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Technical details
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Vendor
|
Intel
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Product type
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Processor
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Status
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Launched
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Launch date
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Q4'19
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Waga i rozmiary
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Processor package size
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45 x 52.5 mm
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|
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Cechy
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Execute Disable Bit
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Y
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Idle States
|
Y
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Thermal Monitoring Technologies
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Y
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CPU configuration (max)
|
1
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Embedded options available
|
N
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Maximum number of PCI Express lanes
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48
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Harmonized System (HS) code
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8542310001
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PCI Express CEM revision
|
3.0
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|
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Warunki pracy
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|
Tcase
|
61 °C
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