|
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Processor
|
|
Processor cores
|
4
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|
Processor frequency
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3.6 GHz
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|
Processor cache
|
8.25 MB
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|
Processor lithography
|
14 nm
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Processor codename
|
Cascade Lake
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|
Processor family
|
Intel Xeon W
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|
Memory bandwidth supported by processor (max)
|
85.3 GB/s
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Box
|
N
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|
Processor ARK ID
|
198018
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|
Cooler included
|
N
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|
Intel Volume Management Device (VMD)
|
Y
|
|
Processor model
|
W-2223
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|
Processor threads
|
8
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Processor operating modes
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64-bit
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|
Processor boost frequency
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3.9 GHz
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Component for
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Server/Workstation
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|
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Technical details
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|
Vendor
|
Intel
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Product type
|
Processor
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|
Status
|
Launched
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Launch date
|
Q4'19
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Bus speed
|
0 GT/s
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|
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Weight & dimensions
|
|
Processor package size
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45 x 52.5 mm
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|
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Graphics
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|
Discrete graphics card
|
N
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|
On-board graphics card model
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Not available
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|
Discrete graphics card model
|
Not available
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|
On-board graphics card
|
N
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|
|
Processor special features
|
|
Intel® AES New Instructions (Intel® AES-NI)
|
Y
|
|
Enhanced Intel SpeedStep Technology
|
Y
|
|
Intel Trusted Execution Technology
|
Y
|
|
Intel VT-x with Extended Page Tables (EPT)
|
Y
|
|
Intel Demand Based Switching
|
Y
|
|
Intel TSX-NI
|
Y
|
|
Intel® Secure Key
|
Y
|
|
Intel 64
|
Y
|
|
Intel® OS Guard
|
Y
|
|
Intel Virtualization Technology for Directed I (O (VT-d))
|
Y
|
|
Intel Software Guard Extensions (Intel SGX)
|
N
|
|
Intel Virtualization Technology (VT-x)
|
Y
|
|
Intel Turbo Boost Max Technology 3.0
|
N
|
|
Intel® Optane™ Memory Ready
|
N
|
|
Intel® Memory Protection Extensions (Intel® MPX)
|
Y
|
|
Intel® Speed Shift Technology
|
Y
|
|
AVX-512 Fused Multiply-Add (FMA) units
|
2
|
|
Intel® Boot Guard
|
Y
|
|
Intel® Deep Learning Boost
|
Y
|
|
Intel® vPro™ Platform Eligibility
|
Y
|
|
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
|
Y
|
|
Intel® Volume Management Device (VMD)
|
Y
|
|
Intel® Identity Protection Technology (Intel® IPT)
|
Y
|
|
Intel® vPro™ Technology
|
Y
|
|
Intel® Hyper Threading Technology (Intel® HT Technology)
|
Y
|
|
Intel® Turbo Boost Technology
|
2.0
|
|
|
Features
|
|
Execute Disable Bit
|
Y
|
|
Idle States
|
Y
|
|
Thermal Monitoring Technologies
|
Y
|
|
Scalability
|
1S
|
|
CPU configuration (max)
|
1
|
|
Embedded options available
|
N
|
|
Maximum number of PCI Express lanes
|
48
|
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Physical Address Extension (PAE)
|
Y 46 bit
|
|
Harmonized System (HS) code
|
8542310001
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|
Supported instruction sets
|
SSE4.2,AVX,AVX 2.0,AVX-512
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|
PCI Express CEM revision
|
3.0
|
|
PCI Express slots version
|
3.0
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|
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Power
|
|
Thermal Design Power (TDP)
|
120 W
|
|
|
Operational conditions
|
|
Tcase
|
64 °C
|
|
|
Memory
|
|
ECC
|
Y
|
|
Maximum internal memory supported by processor
|
1024 GB
|
|
Memory types supported by processor
|
DDR4-SDRAM
|
|
Memory clock speeds supported by processor
|
2666 MHz
|
|
Memory channels
|
Quad
|