|
|
Processor
|
|
Processor cores
|
14
|
|
Processor cache
|
19.25 MB
|
|
Processor manufacturer
|
Intel
|
|
Thermal Design Power (TDP)
|
165 W
|
|
Processor lithography
|
14 nm
|
|
Processor codename
|
Cascade Lake
|
|
Processor cache type
|
Smart Cache
|
|
Processor family
|
Intel® Core™ i9 X-series
|
|
Memory bandwidth supported by processor (max)
|
94 GB/s
|
|
Box
|
N
|
|
Processor socket
|
LGA 2066 (Socket R4)
|
|
Processor ARK ID
|
198014
|
|
Cooler included
|
N
|
|
Generation
|
10th Generation
|
|
Processor base frequency
|
3.3 GHz
|
|
Processor generation
|
10th gen Intel® Core™ i9
|
|
Processor model
|
i9-10940X
|
|
System bus rate
|
8 GT/s
|
|
Processor threads
|
28
|
|
Processor operating modes
|
64-bit
|
|
Processor boost frequency
|
4.6 GHz
|
|
Component for
|
PC
|
|
|
Technical details
|
|
Vendor
|
Intel
|
|
Product type
|
Processor
|
|
Status
|
Launched
|
|
Launch date
|
Q4'19
|
|
Maximum memory
|
256 GB
|
|
Target market
|
Gaming, Content Creation
|
|
Bus speed
|
8 GT/s DMI3
|
|
Supported memory types
|
DDR4-SDRAM
|
|
|
Other features
|
|
Maximum internal memory
|
256 GB
|
|
|
Graphics
|
|
Discrete graphics card
|
N
|
|
On-board graphics card model
|
Not available
|
|
Discrete graphics card model
|
Not available
|
|
On-board graphics card
|
N
|
|
|
Processor special features
|
|
Intel® AES New Instructions (Intel® AES-NI)
|
Y
|
|
Enhanced Intel SpeedStep Technology
|
Y
|
|
Intel 64
|
Y
|
|
Intel Virtualization Technology for Directed I (O (VT-d))
|
Y
|
|
Intel Virtualization Technology (VT-x)
|
Y
|
|
Intel Turbo Boost Max Technology 3.0
|
Y
|
|
Intel® Optane™ Memory Ready
|
Y
|
|
AVX-512 Fused Multiply-Add (FMA) units
|
2
|
|
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
|
Y
|
|
Intel® Turbo Boost Max Technology 3.0 frequency
|
4.8 GHz
|
|
Intel® Hyper Threading Technology (Intel® HT Technology)
|
Y
|
|
Intel® Turbo Boost Technology
|
2.0
|
|
|
Features
|
|
Execute Disable Bit
|
Y
|
|
Scalability
|
1S
|
|
CPU configuration (max)
|
1
|
|
Embedded options available
|
N
|
|
Thermal solution specification
|
PCG 2017X
|
|
Maximum number of PCI Express lanes
|
48
|
|
Market segment
|
Desktop
|
|
Harmonized System (HS) code
|
8542310001
|
|
Supported instruction sets
|
SSE4.1, SSE4.2, AVX 2.0, AVX-512
|
|
Export Control Classification Number (ECCN)
|
5A992C
|
|
Commodity Classification Automated Tracking System (CCATS)
|
G077159
|
|
PCI Express CEM revision
|
3.0
|
|
PCI Express slots version
|
3.0
|
|
|
Operational conditions
|
|
Tjunction
|
86 °C
|
|
|
Memory
|
|
ECC
|
N
|
|
Maximum internal memory supported by processor
|
256 GB
|
|
Memory types supported by processor
|
DDR4-SDRAM
|
|
Memory clock speeds supported by processor
|
2933 MHz
|
|
Memory channels
|
Quad-channel
|
|
|
Packaging data
|
|
Package type
|
Retail box
|